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MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

SCIE,Scopus
期刊简介

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

《MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING》期刊已被查看:

此期刊被最新的JCR期刊SCIE收录

期刊关键词

2区 SCIE Scopus 工程技术 3区 ENGINEERING ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE MULTIDISCIPLINARY 材料科学:综合 PHYSICS APPLIED 物理:应用 CONDENSED MATTER 物理:凝聚态物理

期刊信息
期刊官网:https://www.journals.elsevier.com/materials-science-in-semiconductor-processing
期刊投稿网址:https://www.editorialmanager.com/MSSP
PubMed Central (PMC)链接 :http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D
通讯地:ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
中国科学院《国际期刊预警名单(试行)》名单
2024年02月发布的2024版:不在预警名单中
2023年01月发布的2023版:不在预警名单中
2021年12月发布的2021版:不在预警名单中
2020年12月发布的2020版:不在预警名单中
此期刊被最新的JCR期刊SCIE收录

版面费 审稿速度 收录数据库 是否oa 研究方向
平均1.7个月<br>来源Elsevier官网:平均3.7周 SCIE,Scopus No 工程技术-材料科学:综合
中科院分区
大类学科 分区 小类学科 Top期刊 综述期刊
工程技术 3区 ENGINEERING
ELECTRICAL & ELECTRONIC
工程:电子与电气
MATERIALS SCIENCE
MULTIDISCIPLINARY
材料科学:综合
PHYSICS
APPLIED
物理:应用
PHYSICS
CONDENSED MATTER
物理:凝聚态物理
WOS分区等级:2区
版本 按学科 分区 影响因子
2023-2024年最新版 ENGINEERING
ELECTRICAL & ELECTRONIC
MATERIALS SCIENCE
MULTIDISCIPLINARY
PHYSICS
APPLIED
PHYSICS
CONDENSED MATTER
Q2 4.2
IF值(影响因子)趋势图
年发文量趋势图
自引率趋势图
中科院分区

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